A variety of services are offered by wafer dicing companies. Some of these services include die dicing, plasma dicing, and scribing. This article will discuss these options and how they can help you create the best products. For more information, contact the companies listed below. Also, be sure to ask about their quality control procedures. Some companies even offer their customers a guarantee of their work, if you are not satisfied with their work.
Die dicing for semiconductor wafers is a highly specialized process that yields squares, rectangles, and straight lines. The width of the street, which is the size of the squares left on the tape, depends on several variables, including the blade thickness and the diameter of the wafer. Controlling multiple variables will help produce the most precise results. Die dicing is used in the production of semiconductor devices such as memory chips, integrated circuits, and photovoltaic modules.
The dicing mechanism consists of a rotating blade that crushes the substrate material. The blade is made of diamond grit embedded in an electroplated nickel matrix. The blade moves from one active area of the die to the other along dedicated dicing streets. The blade creates a groove in the substrate material as it passes along the streets. The width of the groove is directly proportional to the blade thickness.
The present invention relates to a method and apparatus for scribing a semiconductor wafer. First, a plurality of boundary segments are formed on the wafer, each region comprising an electronic device. Then, a portion of the insulating layer is removed, exposing the scribe lines. The scribe lines then separate the electronic devices from the wafer while minimizing damage to them.
The scribing process uses blades to cut a groove in a wafer. Typically, this method is used for wafers less than 6 inches in diameter. Today, however, scribing is used for wafers up to 300um thick, and has high throughput and accuracy. It also doesn’t chip the wafer. While this method is generally used for uncoated wafers, scribers are also available for metal coated SiC and DBR coated sapphire wafers.
Wafer dicing can be done with two basic methods: sawing and scribing. The latter is preferred for thin wafers, while the former is used for wafers more than 10 mil thick. The wafer is pre-aligned and mapped before dicing. Then, the wafer is mounted on the dicing tape from the backside. To complete the dicing process, the front side is removed, while the backside is mounted on the dicing tape.
While plasma dicing is low-temperature and low-stress, it is less accurate than laser dicing, requiring masking for non-etchable areas and reducing throughput. Plasma dicing allows you to remove guard rings and use more wafer real-estate to design a chip. This allows you to remove guard rings and utilize wafer real-estate for other active dies.
Traditional blade dicing
Dicing for wafers is a common semiconductor manufacturing process. The process starts with mounting the wafers on adhesive film and positioning them inside a metal frame. Engineers then position the wafer and frame in a chuck. To slice the wafer, the diamond blade is turned between 15,000 and 30,000 RPM. A cooling agent is sprayed along the cutting lines to control temperature and prevent contamination by the saw blade.
Dicing tape is used to mount the wafers. The tape has an adhesive backing, which helps the wafer remain stable during the process. The tape then holds the wafer in place, which is then moved into the dicing saw’s chuck. After the dicing is done, the wafer is thinned, but this can cause problems such as wafer cupping and bowing, making scribing difficult. However, if the wafer is thinned prior to dicing, these problems may be less common.
Simac wafer dicing
Simac offers custom dicing and cutting procedures for semiconductor manufacturers. Typically, semiconductor manufacturers need to use a particular blade or set-up for specific applications. Simac can help these companies with this process and help them achieve higher profitability. In addition, we can help you select the right equipment and blades for your dicing and cutting processes. Simac’s experienced technicians can assist you in the selection process and provide detailed technical advice.
Wafer dicing services are crucial for semiconductor manufacturing, because they separate individual die from semiconductor wafers. The process typically requires varying blade thickness and materials to create individual dice. These dies are then packaged into specific containers, like waffle packs or gel-paks. Simac’s expert scribes can make accurate cuts that minimize chipping, so you can be assured of top-quality results. If you need a custom wafer dicing service, contact us today to learn more about our dicing services.